Future of India’s Chip Industry – Explained

India's chip industry faces challenges in meeting domestic demand, with NITI Aayog calling for sustained investment and strategic partnerships.

Chip Industry
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Chip Industry Latest News

  • NITI Aayog’s Frontier Tech Hub has released a report titled Future of India’s Semiconductor Industry, highlighting the challenges and strategic imperatives for building a globally competitive chip manufacturing ecosystem in India.

About Semiconductors

  • Semiconductors, commonly known as chips, are materials that conduct electricity better than insulators but not as well as conductors. 
  • They form the foundation of modern electronics and are found in virtually every electronic device, including:
    • Consumer electronics: Smartphones, laptops, televisions, and home appliances.
    • Automobiles: Modern cars contain hundreds of chips for engine control, infotainment, and safety systems.
    • Defence equipment: Missiles, radars, satellites, and communication systems.
    • Industrial machinery: Robots, automation systems, and IoT devices.
    • Healthcare devices: Medical imaging, diagnostic equipment, and wearables.

Stages of Semiconductor Manufacturing

  • The semiconductor value chain comprises several stages:
    • Design: Creating chip architecture and circuits.
    • Fabrication (Fabs): Manufacturing the actual chip on silicon wafers in highly specialised facilities.
    • Assembly, Testing, Marking, and Packaging (ATMP): Final stages where chips are packaged and tested before shipment.
  • Fabrication is the most capital-intensive and technologically complex stage, requiring ultra-clean environments and specialised equipment costing billions of dollars.

India’s Semiconductor Push

  • The Union government launched the India Semiconductor Mission (ISM) with a corpus of Rs. 76,000 crore to develop a robust semiconductor ecosystem. The mission supports:
    • Semiconductor fabrication units with capital subsidies of over 50%.
    • Display fabs for manufacturing display panels.
    • Compound semiconductors and packaging facilities.
    • Design-linked incentives for chip design startups.
    • Bulk subscriptions to industry-grade semiconductor design applications for students and academia.
  • Current Status
    • India does not yet have a single operational fabrication unit.
    • The first fabrication unit is expected to begin operations in Dholera, Gujarat by 2028.
    • A total of ten semiconductor projects are in various stages of development.
    • Multiple semiconductor packaging and testing facilities have been approved with significant subsidies.

Key Findings of the NITI Aayog Report

  • India’s Current Ecosystem Is Not Self-Sufficient
    • The report explicitly states: “India’s local ecosystem is not ready to fully meet domestic demand for semiconductors.” 
    • Even chips used in domestic electronics assembly are largely sourced from outside the country.
  • National Security Imperative
    • Many semiconductor parts used in defence systems are produced outside India.
    • This creates threats to national security as India deploys foreign chips in aerospace and defence programmes.
    • Geopolitical disruptions, such as a potential disaster in Taiwan, which dominates global chip manufacturing, could massively disrupt the global electronics supply chain.
  • Long Gestation Period
    • Fabrication units typically require 4-5 years before commencing production.
    • Investment in 50+ specialised equipment from global players is required during the gestation phase.
    • Yield optimization and reliability testing take several quarters even after production begins.
    • Talent development for semiconductor fabs is similarly time-consuming.
    • The sector requires “sustained, mission-mode commitment over a decade or more,” the report states.

Strategic Recommendations

  • Building Sovereign Capabilities
    • Sovereign design and research capabilities to reduce dependence on foreign IP.
    • R&D excellence in materials sciences and silicon design.
    • Harnessing agentic AI for semiconductor engineering.
    • Moving from a services-led design base to becoming a creator of differentiated IP, architectures, and integration technologies.
  • Capital Investment Requirements
    • The report estimates the necessary capital expenditure from the state at $45-60 billion over a decade for the second phase of the India Semiconductor Mission (ISM 2.0).
  • Strategic Focus Areas
    • Away from frontier chips (3-7 nanometre transistors) where risks are very high.
    • Towards mature and advanced nodes aligned with strategic relevance.
    • Focus on compound semiconductors for defence and industrial applications.
    • Emphasise “selective depth, capital efficiency, and system-level differentiation” rather than attempting to replicate the full global manufacturing spectrum.
  • Packaging as a Core Pillar
    • The report identifies chip packaging, traditionally seen as a downstream activity, as a “core production pillar”:
    • Less expensive and complex than fabrication.
    • Can enable rapid import substitution in high-volume domestic segments.
    • Provides a strategic entry point into the global semiconductor value chain.
  • Trusted Partners Strategy
    • The report outlines a strategic partnership framework for India’s semiconductor ambitions:
  • Priority Partners
    • The report highlights the following nations as trusted partners: the United States, Japan, the European Union and South Korea
  • Areas of Collaboration
    • Cooperation with these partners would provide:
    • Access to critical tools, equipment servicing, and lifecycle support.
    • Leveraging India’s market scale, talent base, and packaging capacity.
    • Joint research and development opportunities.
    • Technology transfer arrangements.
  • China as an Adversary
    • The report implies that China remains an adversary in chipmaking despite recent diplomatic thaws between the two nations. 
    • This reflects the broader geopolitical realignment in the semiconductor industry, where Western nations and their allies are seeking to reduce dependence on Chinese supply chains.

Challenges Facing India’s Semiconductor Industry

  • Capital Intensity
    • Setting up a single fab requires billions of dollars in investment.
    • High operational costs and long payback periods deter private investment.
    • Need for sustained government support over decades.
  • Technology Gap
    • India lags significantly behind established semiconductor manufacturers like Taiwan (TSMC), South Korea (Samsung), and the US.
    • Lack of indigenous process technology and IP.
    • Heavy reliance on foreign equipment and expertise.
  • Talent Shortage
    • Shortage of specialised engineers with semiconductor manufacturing experience.
    • Need for comprehensive training programmes and educational reforms.
    • Competition for talent with established global semiconductor hubs.
  • Supply Chain Dependencies
    • Dependence on imported raw materials, chemicals, and gases.
    • Need to develop a domestic ecosystem of suppliers.
    • Vulnerability to geopolitical disruptions.
  • Infrastructure Requirements
    • Need for reliable power supply, ultra-pure water, and specialised gases.
    • Requirement for clean room facilities with stringent environmental controls.
    • Long lead times for setting up support infrastructure.

Source: TH | NITI Aayog

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Chip Industry FAQs

Q1. What is the India Semiconductor Mission (ISM)?+

Q2. When is India's first semiconductor fabrication unit expected to begin operations?+

Q3. What capital investment does the NITI Aayog report estimate for ISM 2.0?+

Q4. Why is semiconductor manufacturing strategically important for India?+

Q5. Which countries does the report identify as trusted partners for India?+

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